铸造服务
以及用于相应的器件制造工艺的设备的研究和开发，整个过程 或由客户提供 它提供代工服务的完整的产品开发过程，包括设计和定制开发.
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Mass product or coordinator for power devices form wafer in to wafer out total solution
| 艺术 |
|---|
| Front-end processing |
| Photolithography resolution down to 0.4 µm feature with 0.1µm alignment accuracy |
| Trench technology down to 3um depth without micro trench |
| Thermal oxidation and gate stack processes |
| Films deposition and etch |
| High temperature implant |
| High temperature implant anneal |
| Metallization |
| Backside metal deposition |
| Ni, Al, Ti/TiN Ag deposition and etch |
| Semiconductor device and test patterns |
| Fabrication of test structures |
| Manufacturing of semiconductor devices |
| Characterization |
| Inline parametric and reliability electrical testing and characterization |
| 设施 |
|---|
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| 6-inch SiC processing capabilities |
| Class-10 capable cleanroom |
| Custom development and manufacturing |
