It provides foundry services for complete product development, including development and research of device-wide process processes, as well as design and custom process development provided by standards or customers.
Mass product or coordinator for power devices form wafer in to wafer out total solution
Technology |
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Front-end processing |
Photolithography resolution down to 0.4 µm feature with 0.1µm alignment accuracy |
Trench technology down to 3um depth without micro trench |
Thermal oxidation and gate stack processes |
Films deposition and etch |
High temperature implant |
High temperature implant anneal |
Metallization |
Backside metal deposition |
Ni, Al, Ti/TiN Ag deposition and etch |
Semiconductor device and test patterns |
Fabrication of test structures |
Manufacturing of semiconductor devices |
Characterization |
Inline parametric and reliability electrical testing and characterization |
Facility |
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6-inch SiC processing capabilities |
Class-10 capable cleanroom |
Custom development and manufacturing |